Design of Capacitive Micromachined Ultrasonic Transducers (Cmuts) on a Flexible Substrate for Intravascular Ultrasonography (Ivus) Applications

dc.contributor.author Hah, Dooyoung
dc.contributor.author Je, Changhan
dc.contributor.author Lee, Sung Q.
dc.date.accessioned 2025-09-25T10:44:23Z
dc.date.available 2025-09-25T10:44:23Z
dc.date.issued 2017
dc.description CMP; CNRS; et al.; IEEE Components, Packaging and Manufacturing Technology Society (CPMT); IMS-BORDEAUX; LIRMM en_US
dc.description.abstract Effects of substrate bending to the characteristics of capacitive miniaturized ultrasonic transducers (CMUTs) on a flexible substrate are studied through finite element analysis (FEA) for the design purpose. The target application of the devices is intravascular ultrasonography (IVUS) where transducers are brought to the proximity of the imaging targets so that high resolution images can be obtained without much concern of signal attenuation. In order to eliminate mechanical rotation used in the conventional IVUS, the transducer array can be manufactured on a flexible substrate and to wrap it around a cylindrical frame. It can be anticipated that the characteristics of the transducers will be altered by such bending of the substrate through geometrical dimension changes and stress induced. Pull-in voltages and resonant frequencies of CMUTs were studied via FEA for various bending radii and membrane thicknesses. It was found that both pull-in voltages and resonant frequencies become smaller for the transducers on a bent substrate compared to the ones on a flat substrate. It was also found that pull-in voltages decrease as the substrate bending radius is reduced. © 2017 Elsevier B.V., All rights reserved. en_US
dc.identifier.doi 10.1109/DTIP.2017.7984489
dc.identifier.isbn 9781538629529
dc.identifier.scopus 2-s2.0-85027858659
dc.identifier.uri https://doi.org/10.1109/DTIP.2017.7984489
dc.identifier.uri https://hdl.handle.net/20.500.12573/3587
dc.language.iso en en_US
dc.publisher Institute of Electrical and Electronics Engineers Inc. en_US
dc.relation.ispartof -- 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 -- Bordeaux -- 129344 en_US
dc.rights info:eu-repo/semantics/closedAccess en_US
dc.subject Capacitive Miniaturized Ultrasonic Transducer (Cmut) en_US
dc.subject Flexible Substrate en_US
dc.subject Intravascular Ultrasonography (Ivus) en_US
dc.subject Chip Scale Packages en_US
dc.subject Finite Element Method en_US
dc.subject Natural Frequencies en_US
dc.subject Substrates en_US
dc.subject Transducers en_US
dc.subject Ultrasonography en_US
dc.subject Capacitive Micromachined Ultrasonic Transducer en_US
dc.subject Capacitive Miniaturized Ultrasonic Transducer (Cmut) en_US
dc.subject Flexible Substrate en_US
dc.subject Geometrical Dimensions en_US
dc.subject High Resolution Image en_US
dc.subject Intravascular en_US
dc.subject Mechanical Rotation en_US
dc.subject Signal Attenuation en_US
dc.subject Ultrasonic Transducers en_US
dc.title Design of Capacitive Micromachined Ultrasonic Transducers (Cmuts) on a Flexible Substrate for Intravascular Ultrasonography (Ivus) Applications en_US
dc.type Conference Object en_US
dspace.entity.type Publication
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gdc.description.department Abdullah Gül University en_US
gdc.description.departmenttemp [Hah] Dooyoung, Department of Electrical and Electronic Engineering, Abdullah Gül Üniversitesi, Kayseri, Turkey; [Je] Changhan, Multidisciplinary Sensor Research Group, Electronics and Telecommunications Research Institute, Daejeon, South Korea; [Lee] Sung Q., Multidisciplinary Sensor Research Group, Electronics and Telecommunications Research Institute, Daejeon, South Korea en_US
gdc.description.endpage 5
gdc.description.publicationcategory Konferans Öğesi - Uluslararası - Kurum Öğretim Elemanı en_US
gdc.description.scopusquality N/A
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gdc.opencitations.count 5
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gdc.virtual.author Hah, Dooyoung
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