Design of Capacitive Micromachined Ultrasonic Transducers (Cmuts) on a Flexible Substrate for Intravascular Ultrasonography (Ivus) Applications

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Date

2017

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Institute of Electrical and Electronics Engineers Inc.

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Green Open Access

No

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Abstract

Effects of substrate bending to the characteristics of capacitive miniaturized ultrasonic transducers (CMUTs) on a flexible substrate are studied through finite element analysis (FEA) for the design purpose. The target application of the devices is intravascular ultrasonography (IVUS) where transducers are brought to the proximity of the imaging targets so that high resolution images can be obtained without much concern of signal attenuation. In order to eliminate mechanical rotation used in the conventional IVUS, the transducer array can be manufactured on a flexible substrate and to wrap it around a cylindrical frame. It can be anticipated that the characteristics of the transducers will be altered by such bending of the substrate through geometrical dimension changes and stress induced. Pull-in voltages and resonant frequencies of CMUTs were studied via FEA for various bending radii and membrane thicknesses. It was found that both pull-in voltages and resonant frequencies become smaller for the transducers on a bent substrate compared to the ones on a flat substrate. It was also found that pull-in voltages decrease as the substrate bending radius is reduced. © 2017 Elsevier B.V., All rights reserved.

Description

CMP; CNRS; et al.; IEEE Components, Packaging and Manufacturing Technology Society (CPMT); IMS-BORDEAUX; LIRMM

Keywords

Capacitive Miniaturized Ultrasonic Transducer (Cmut), Flexible Substrate, Intravascular Ultrasonography (Ivus), Chip Scale Packages, Finite Element Method, Natural Frequencies, Substrates, Transducers, Ultrasonography, Capacitive Micromachined Ultrasonic Transducer, Capacitive Miniaturized Ultrasonic Transducer (Cmut), Flexible Substrate, Geometrical Dimensions, High Resolution Image, Intravascular, Mechanical Rotation, Signal Attenuation, Ultrasonic Transducers

Fields of Science

0103 physical sciences, 01 natural sciences

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5

Source

-- 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 -- Bordeaux -- 129344

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1

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5
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