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Investigations of Electrical Resistivity and Thermal Conductivity Dependences on Growth Rate in the Al-Cu Eutectic Alloy
(Springer/plenum Publishers, 2021-05-03) Marasli, Necmettin; Bayram, Umit
Directional solidification of Al-Cu-Ti (Al-33wt%Cu-0.1wt%Ti) eutectic alloy was done with a growth rate range (V = 8.58 to 2038.65 mu m.s(-1)) at a temperature gradient of 6.45 K.mm(-1) using Bridgman-type directional solidification furnace. The measurements of thermal conductivity (K) and electrical resistivity (rho) for the Al-Cu-Ti alloy solidified with the different values of V were made by the longitudinal heat flow method (LHFM) and DC four-point probe technique (FPPT). While the highest values of K and rho were determined to be 236.04 W.K-1.m(-1) and 5.91 x 10(-8) omega m, respectively, at 8.58 mu m.s(-1), the lowest values of K and rho were obtained to be 199.82 W.K-1.m(-1) and 12.11 x 10(-8) omega m, respectively, at 2038.65 mu m.s(-1). The K and rho dependences on V were obtained to be K=259.96xV(-0.032) and rho=4.47x10(-8)V(0.13) from linear regression analysis. The fusion enthalpy ( increment H) and specific heat difference between solid and liquid ( increment C-P) for the Al-Cu-Ti were also determined to be 222.69 J.g(-1) and 0.266 Jg(-1).K-1, respectively, by means of differential scanning calorimetry (DSC).

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