Scopus İndeksli Yayınlar Koleksiyonu
Permanent URI for this collectionhttps://hdl.handle.net/20.500.12573/395
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Article Minimization of Thermal Stresses in Instrumented Cutting Tools with Embedded Thin Film Thermocouples(Korean Society of Mechanical Engineers, 2026-04) Kesriklioglu, Sinan; Sivesoglu, AbdurrahmanThis study investigates the optimization of multilayer coatings on cutting tools to minimize thermal stress and temperature differences between the tool-chip interface and embedded thermocouples. The novelty of this study lies in directly linking coating architecture to temperature measurement accuracy, revealing that coatings not only affect heat dissipation and stress development but may also distort the apparent temperature recorded by embedded sensors. The types and thickness ranges of thin film layers in instrumented cutting tools were determined, and multi-physics finite element simulations were then used to evaluate coating configurations under thermal loading, assessing both stress distribution and temperature variance in the multilayer coating system. The Taguchi method, coupled with desirability analysis, identified optimal coating parameters that simultaneously minimize thermal stresses and temperature disparities, which are critical for accurate temperature measurements and extending the lifespan of cutting inserts. This framework enables a controllable trade-off between mechanical reliability and thermal measurement fidelity. The results reveal significant interactions among coating configurations (settings) and between thermal and mechanical properties of the materials used, demonstrating that careful selection of layer materials and thicknesses optimizes stress and temperature responses yielding thermal stress of 1628 MPa (second lowest and only 0.4 % higher than the minimum) and temperature difference of 12.1 degrees C (third lowest and 55 % lower than average). These findings underscore the potential of precise coating design to enhance tool performance and longevity in high temperature machining applications.Article Raster Orientation Effects on the Adhesion of iCVD-Deposited PSA Thin Films on FDM-Printed PLA(MDPI, 2026-01-30) Yilmaz, Kurtulus; Gursoy, Mehmet; Gunes, Aydin; Karaman, MustafaThe adhesion performance of pressure-sensitive adhesive (PSA) thin films on additively manufactured polymers is strongly governed by surface anisotropy induced during printing. In this study, PSA thin films based on 2-ethylhexyl acrylate (EHA) and acrylic acid (AA) were deposited by initiated chemical vapor deposition (iCVD) onto fused deposition modeling (FDM) printed PLA substrates with different raster orientations (0 degrees, 30 degrees, 60 degrees, and 90 degrees). The deposited films exhibited high optical transparency on glass, and thicknesses consistent with the targeted deposition. Adhesion performance was evaluated using tensile and three-point bending tests, revealing a strong dependence on raster orientation. The 0 degrees raster orientation yielded the highest shear adhesion strengths, reaching 12.03 N/cm2 under tensile loading and 4.59 N/cm2 under bending, along with the largest failure displacements. In contrast, specimens printed at 90 degrees exhibited an approximately 47% reduction in tensile shear adhesion strength and limited deformation prior to failure. SEM analysis showed that raster alignment parallel to the loading direction promoted extensive adhesive deformation and PSA fibrillation, whereas higher raster angles resulted in predominantly interfacial debonding. These results demonstrate that raster orientation is a critical design parameter for tuning PSA adhesion on FDM-printed PLA substrates without modifying adhesive chemistry.