WoS İndeksli Yayınlar Koleksiyonu
Permanent URI for this collectionhttps://hdl.handle.net/20.500.12573/394
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Article Citation - WoS: 4Citation - Scopus: 4Investigations of Electrical Resistivity and Thermal Conductivity Dependences on Growth Rate in the Al-Cu Eutectic Alloy(Springer/plenum Publishers, 2021-05-03) Marasli, Necmettin; Bayram, UmitDirectional solidification of Al-Cu-Ti (Al-33wt%Cu-0.1wt%Ti) eutectic alloy was done with a growth rate range (V = 8.58 to 2038.65 mu m.s(-1)) at a temperature gradient of 6.45 K.mm(-1) using Bridgman-type directional solidification furnace. The measurements of thermal conductivity (K) and electrical resistivity (rho) for the Al-Cu-Ti alloy solidified with the different values of V were made by the longitudinal heat flow method (LHFM) and DC four-point probe technique (FPPT). While the highest values of K and rho were determined to be 236.04 W.K-1.m(-1) and 5.91 x 10(-8) omega m, respectively, at 8.58 mu m.s(-1), the lowest values of K and rho were obtained to be 199.82 W.K-1.m(-1) and 12.11 x 10(-8) omega m, respectively, at 2038.65 mu m.s(-1). The K and rho dependences on V were obtained to be K=259.96xV(-0.032) and rho=4.47x10(-8)V(0.13) from linear regression analysis. The fusion enthalpy ( increment H) and specific heat difference between solid and liquid ( increment C-P) for the Al-Cu-Ti were also determined to be 222.69 J.g(-1) and 0.266 Jg(-1).K-1, respectively, by means of differential scanning calorimetry (DSC).Article Citation - WoS: 6Citation - Scopus: 6Experimental Measurements of Some Thermophysical Properties of Solid CdSb Intermetallic in the Sn-Cd Ternary Alloy(Springer, 2016) Ozturk, Esra; Aksoz, Sezen; Altintas, Yemliha; Keslioglu, Kazum; Marasli, NecmettinThe equilibrated grain boundary groove shapes of solid CdSb in equilibrium with Sn-Cd-Sb eutectic liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of the solid CdSb intermetallic were determined from the observed grain boundary groove shapes. The thermal conductivity of the eutectic solid and the thermal conductivity ratio of eutectic liquid to the eutectic solid in the Sn-35.8 at.%Cd-6.71 at.%Sb eutectic alloy at its eutectic melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively.