WoS İndeksli Yayınlar Koleksiyonu

Permanent URI for this collectionhttps://hdl.handle.net/20.500.12573/394

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Department: search.filters.department.Abdullah Gül UniversitySubject: search.filters.subject.Thermal Analysis

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  • Article
    Thermal Stresses in SOFC Stacks: The Role of Mismatch Among Thermal Conductivity of Adjacent Components
    (Tubitak Scientific & Technological Research Council Turkey, 2021-06-30) Aydin, Ozgur; Matsumoto, Go; Shiratori, Yusuke
    Generating power from renewable biogas in solid oxide fuel cells (SOFCs) is an environment-friendly, efficient, and promising energy conversion process. Biogas can be used in SOFCs via a reforming process for which dry reforming is more suitable as the reforming agent exists in the biogas mixture. Biogas can be directly reformed to H-2 -rich fuel stream in the anode chamber of a SOFC by the heat released during power generation. Exploiting the heat and water produced in the SOFC for internal reforming of biogas makes the energy conversion process very efficient; however, various challenges are reported. Thus, indirect internal reforming is opted for which a separate reforming domain is required. In an indirect internal reformer operating at usual conditions, dry reforming rate is quite high in the inlet and it decreases steeply toward the fuel outlet. Great temperature gradients develop over the reformer, since the dry reforming reaction is strongly endothermic. The abruptly varying rate of the reforming reaction affects the temperature fields in the adjacent components of SOFC and hence intolerable thermal stresses emerge on the SOFC components. In our preceding study, we graded the reforming domain, homogenized the temperature profile over the reforming domain, and executed performance and durability experiments. However, most of the experiments failed due to fracturing SOFC components hinting at existence of thermal stresses. In that study, we focused on minimizing the temperature gradients within the reforming domain; namely, we neglected the other processes. To eliminate the thermal stresses, we modeled the entire module of SOFC equipped with a reformer featuring a graded reforming domain. We found that the mismatch between the thermal conductivities of the adjacent module components is the major reason for the thermal stresses. When the mismatch is eliminated, thermal stresses disappear even if the reforming domain is not graded.
  • Article
    Citation - WoS: 23
    Citation - Scopus: 21
    The Measurements of Electrical and Thermal Conductivity Variations With Temperature and Phonon Component of the Thermal Conductivity in Sn-Cd Sn-In Sn-Ag and Sn-Bi Alloys
    (Elsevier France-editions Scientifiques Medicales Elsevier, 2016-02) Altintas, Yemliha; Kaygisiz, Yusuf; Ozturk, Esra; Aksoz, Sezen; Keslioglu, Kazim; Marasli, Necmettin; Kayglslz, Yusuf; Altlntas, Yemliha
    The electrical and thermal conductivity variations with temperature for lead-free ternary solders, namely Sn-41.39 at.% Cd-6.69 at.% Sb, Sn-49 at.% In-1 at.% Cu, Sn-50 at.% Ag-10 at.% Bi and Sn-32 at.% Bi-3 at.% Zn alloys, were measured by the d.c. four-point probe method and radial heat flow apparatus, respectively. The contributions of electrons and phonons to the thermal conductivity were separately determined by using the measured values of the thermal and electrical conductivities obtained by the Wiedemann-Franz law in the lead-free ternary solders. The percentages of the phonon component of thermal conductivity were found to be in the range of 46-55%, 46-50%, 38-47% and 69-73% for Sn-41.39 at.% Cd-6.69 at.% SU, Sn-49 at.% In-1 at.% Cu, Sn-50 at.% Ag-10 at.% Bi and Sn-32 at.% Bi-3 at.% Zn alloys at the ranges of 318-443 K temperature, respectively. The temperature coefficients (alpha) of electrical conductivity for the lead-free ternary solders were found to be 2.47 x 10(-3), 4.97 x 10(-3), 1.14 x 10(-3) and 1.00 x 10(-3) K-1, respectively. The thermal conductivities of the solid phases at their melting temperature and the thermal temperature coefficients for the lead-free ternary solders were also found to be 47.72 +/- 2.38, 68.57 +/- 3.42, 73.52 +/- 3.67, 37.53 +/- 1.87 W/Km and 1.47 x 10(-3), 1.48 x 10(-3), 1.85 x 10(-3) and 2.21 x 10(-3) K-1, respectively. (C) 2015 Elsevier Masson SAS. All rights reserved.
  • Article
    Citation - WoS: 5
    Citation - Scopus: 6
    Experimental Determination of Interfacial Energies for Solid Sn in Equilibrium With Sn-Mg Liquid
    (Korean inst Metals Materials, 2015-03) Altintas, Yemliha; Ozturk, Esra; Aksoz, Sezen; Keslioglu, Kazim; Marasli, Necmettin
    The equilibrated grain boundary groove shapes of solid Sn in equilibrium with Sn-Mg-Zn liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn were determined from the observed grain boundary groove shapes. The thermal conductivity of the eutectic solid phase for Sn-8.12 at% Mg-4.97 at% Zn alloy and the thermal conductivity ratio of the liquid phase to the solid phase for Sn-8.12 at% Mg-4.97 at% Zn alloy at eutectic temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn in equilibrium with Sn-Mg-Zn liquid were determined to be (8.3 +/- 0.6)x10(-8) Km, (118.5 +/- 14.2)x10(-3) Jm(-2) and (225.1 +/- 29.3)x10(-3) J m(-2) respectively from observed grain boundary groove shapes. A comparison of present results for solid Sn in the Sn-8.12 at% Mg-4.97 at% Zn alloy with the results obtained in previous works for similar solid Sn in equilibrium with different binary or ternary liquid was made.
  • Article
    Citation - WoS: 6
    Citation - Scopus: 6
    Experimental Measurements of Some Thermophysical Properties of Solid CdSb Intermetallic in the Sn-Cd Ternary Alloy
    (Springer, 2016) Ozturk, Esra; Aksoz, Sezen; Altintas, Yemliha; Keslioglu, Kazum; Marasli, Necmettin
    The equilibrated grain boundary groove shapes of solid CdSb in equilibrium with Sn-Cd-Sb eutectic liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of the solid CdSb intermetallic were determined from the observed grain boundary groove shapes. The thermal conductivity of the eutectic solid and the thermal conductivity ratio of eutectic liquid to the eutectic solid in the Sn-35.8 at.%Cd-6.71 at.%Sb eutectic alloy at its eutectic melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively.