WoS İndeksli Yayınlar Koleksiyonu

Permanent URI for this collectionhttps://hdl.handle.net/20.500.12573/394

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Author: search.filters.author.Aksoz, SezenSubject: search.filters.subject.Thermal Analysis

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  • Article
    Citation - WoS: 23
    Citation - Scopus: 21
    The Measurements of Electrical and Thermal Conductivity Variations With Temperature and Phonon Component of the Thermal Conductivity in Sn-Cd Sn-In Sn-Ag and Sn-Bi Alloys
    (Elsevier France-editions Scientifiques Medicales Elsevier, 2016-02) Altintas, Yemliha; Kaygisiz, Yusuf; Ozturk, Esra; Aksoz, Sezen; Keslioglu, Kazim; Marasli, Necmettin; Kayglslz, Yusuf; Altlntas, Yemliha
    The electrical and thermal conductivity variations with temperature for lead-free ternary solders, namely Sn-41.39 at.% Cd-6.69 at.% Sb, Sn-49 at.% In-1 at.% Cu, Sn-50 at.% Ag-10 at.% Bi and Sn-32 at.% Bi-3 at.% Zn alloys, were measured by the d.c. four-point probe method and radial heat flow apparatus, respectively. The contributions of electrons and phonons to the thermal conductivity were separately determined by using the measured values of the thermal and electrical conductivities obtained by the Wiedemann-Franz law in the lead-free ternary solders. The percentages of the phonon component of thermal conductivity were found to be in the range of 46-55%, 46-50%, 38-47% and 69-73% for Sn-41.39 at.% Cd-6.69 at.% SU, Sn-49 at.% In-1 at.% Cu, Sn-50 at.% Ag-10 at.% Bi and Sn-32 at.% Bi-3 at.% Zn alloys at the ranges of 318-443 K temperature, respectively. The temperature coefficients (alpha) of electrical conductivity for the lead-free ternary solders were found to be 2.47 x 10(-3), 4.97 x 10(-3), 1.14 x 10(-3) and 1.00 x 10(-3) K-1, respectively. The thermal conductivities of the solid phases at their melting temperature and the thermal temperature coefficients for the lead-free ternary solders were also found to be 47.72 +/- 2.38, 68.57 +/- 3.42, 73.52 +/- 3.67, 37.53 +/- 1.87 W/Km and 1.47 x 10(-3), 1.48 x 10(-3), 1.85 x 10(-3) and 2.21 x 10(-3) K-1, respectively. (C) 2015 Elsevier Masson SAS. All rights reserved.
  • Article
    Citation - WoS: 5
    Citation - Scopus: 6
    Experimental Determination of Interfacial Energies for Solid Sn in Equilibrium With Sn-Mg Liquid
    (Korean inst Metals Materials, 2015-03) Altintas, Yemliha; Ozturk, Esra; Aksoz, Sezen; Keslioglu, Kazim; Marasli, Necmettin
    The equilibrated grain boundary groove shapes of solid Sn in equilibrium with Sn-Mg-Zn liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn were determined from the observed grain boundary groove shapes. The thermal conductivity of the eutectic solid phase for Sn-8.12 at% Mg-4.97 at% Zn alloy and the thermal conductivity ratio of the liquid phase to the solid phase for Sn-8.12 at% Mg-4.97 at% Zn alloy at eutectic temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn in equilibrium with Sn-Mg-Zn liquid were determined to be (8.3 +/- 0.6)x10(-8) Km, (118.5 +/- 14.2)x10(-3) Jm(-2) and (225.1 +/- 29.3)x10(-3) J m(-2) respectively from observed grain boundary groove shapes. A comparison of present results for solid Sn in the Sn-8.12 at% Mg-4.97 at% Zn alloy with the results obtained in previous works for similar solid Sn in equilibrium with different binary or ternary liquid was made.
  • Article
    Citation - WoS: 6
    Citation - Scopus: 6
    Experimental Measurements of Some Thermophysical Properties of Solid CdSb Intermetallic in the Sn-Cd Ternary Alloy
    (Springer, 2016) Ozturk, Esra; Aksoz, Sezen; Altintas, Yemliha; Keslioglu, Kazum; Marasli, Necmettin
    The equilibrated grain boundary groove shapes of solid CdSb in equilibrium with Sn-Cd-Sb eutectic liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of the solid CdSb intermetallic were determined from the observed grain boundary groove shapes. The thermal conductivity of the eutectic solid and the thermal conductivity ratio of eutectic liquid to the eutectic solid in the Sn-35.8 at.%Cd-6.71 at.%Sb eutectic alloy at its eutectic melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively.