WoS İndeksli Yayınlar Koleksiyonu
Permanent URI for this collectionhttps://hdl.handle.net/20.500.12573/394
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Article Citation - WoS: 4Citation - Scopus: 4Thermal Conductivity and Interfacial Energy of Solid Bi in the Bi-Ag Eutectic System(Springer, 2015-05-15) Altintas, Yemliha; Ozturk, Esra; Aksoz, Sezen; Keslioglu, Kazim; Marasli, Necmettin; Maraşlı, Necmettin; Keşlioğlu, Kâzım; Altıntas, YemlihaThe equilibrated grain boundary groove shapes for solid Bi (Bi-2.87 at.%Ag) in equilibrium with Bi-Ag eutectic liquid have been observed from quenched sample with a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Bi have been determined from the observed grain boundary groove shapes. The variation of thermal conductivity with temperature for eutectic solid phase (Bi-4.7 at.%Ag) has been measured. The ratio of thermal conductivity of equilibrated eutectic liquid phase to eutectic solid phase has also been measured with a Bridgman-type growth apparatus at the melting temperature. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Bi in equilibrium with Bi-Ag eutectic liquid were determined to be (9.2 +/- A 0.6) x 10(-8) K m, (52.7 +/- A 6.3) x 10(-3) J m(-2) and (102.4 +/- A 13.3) x 10(-3) J m(-2), respectively, from observed grain boundary groove shapes.Article Citation - WoS: 1Citation - Scopus: 1The Variations of Electrical Resistivity and Thermal Conductivity With Growth Rate for the Zn-Al Eutectic Alloy(Springer, 2021-06-24) Marasli, Necmettin; Bayram, Umit; Aksoz, SezenThe Zn-Al-Cu alloy (Zn-5wt%Al-0.5wt%Cu) is solidified with different growth rates (V = 8.45-2087.15 mu m s(-1)) at a constant temperature gradient (G = 3.67 K mm(-1)) using Bridgman-type directional solidification apparatus (BTDSA). The thermal conductivity (K) and electrical resistivity (rho) for the Zn-Al-Cu alloy solidified with the different V values are measured by the longitudinal heat flow method (LHFM) and DC four-point probe technique (FPPT), respectively. The lambda and K decrease with the increasing V, while the q increases with increasing V in the Zn-Al-Cu eutectic alloy. The dependences of rho and K on lambda and V for the Zn-Al-Cu eutectic alloy are obtained as rho = 9.98 x 10(-8)lambda(-0.18), q = 7.03 x 10(-8) V-0.07, K = 110.91 lambda(0.104) and K = 144.59V(-0.040), respectively. The melting enthalpy (DHf) and specific heat difference between solid and liquid phases (Delta C-p) for the Zn-Al-Cu eutectic alloy are determined as 113.89 J g(-1) and 0.172 J g(-1) K-1, respectively, by the differential scanning calorimetry (DSC).Article Citation - WoS: 1Citation - Scopus: 1The Experimental Determination of Interfacial Energies for Solid Zn in Equilibrium With Zn-Al Liquid(Springer, 2015-06-16) Altintas, Yemliha; Ozturk, Esra; Aksoz, Sezen; Keslioglu, Kazim; Marasli, NecmettinThe equilibrated grain boundary groove shapes of solid Zn in equilibrium with Zn-Al-Sb liquid were observed from a quenched sample using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy, and grain boundary energy of the solid Zn were determined from the observed grain boundary groove shapes. The thermal conductivity of the eutectic solid phase for Zn-0.4 at. pct Al-0.4 at. pct Sb alloy and the thermal conductivity ratio of the liquid phase to the solid phase for Zn-0.4 at. pct Al-0.4 at. pct Sb alloy at eutectic temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively.Article Citation - WoS: 1Citation - Scopus: 1Effect of Sn Contents on Thermodynamic, Microstructure and Mechanical Properties in the Zn90-Bi10 and Bi88-Zn12 Based Ternary Alloys(Springer, 2019-01-10) Esener, Pinar Ata; Altintas, Yemliha; Bayram, Umit; Ozturk, Esra; Marasli, Necmettin; Aksoz, SezenThe thermal conductivity variations with temperature for Zn90-x-Sn-x-Bi10 (x=5,10, 40 and 85wt%) and Bi88-x-Sn-x-Zn-12 (x=1.39, 43.26 and 79.3wt%) alloys were measured by using the linear heat flow method. From thermal conductivity-temperature plots, the coefficients of thermal conductivity for the Zn-Sn-Bi alloys were calculated. The microstructures of Zn-Sn-Bi alloys were observed using scanning electron microscopy (SEM). The existing phases into microstructure were identified energy dispersive X-ray (EDX) analysis. The melting temperatures, the enthalpy of fusion and specific heat change between the liquid and solid phases in the Zn-Sn-Bi alloys were determined from Differential Scanning Calorimetry (DSC) trace. The tensile strength and microhardness of the alloys were measured using a Shimadzu Universal Testing Instrument (Type AG-10 KNG) and Future-Tech FM-700 model microhardness device.Article Citation - WoS: 6Citation - Scopus: 6Experimental Measurements of Some Thermophysical Properties of Solid CdSb Intermetallic in the Sn-Cd Ternary Alloy(Springer, 2016) Ozturk, Esra; Aksoz, Sezen; Altintas, Yemliha; Keslioglu, Kazum; Marasli, NecmettinThe equilibrated grain boundary groove shapes of solid CdSb in equilibrium with Sn-Cd-Sb eutectic liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of the solid CdSb intermetallic were determined from the observed grain boundary groove shapes. The thermal conductivity of the eutectic solid and the thermal conductivity ratio of eutectic liquid to the eutectic solid in the Sn-35.8 at.%Cd-6.71 at.%Sb eutectic alloy at its eutectic melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively.