Esener, Pinar AtaAltintas, YemlihaBayram, UmitOzturk, EsraMarasli, NecmettinAksoz, Sezen2025-09-252025-09-2520190957-45221573-482Xhttps://doi.org/10.1007/s10854-018-00648-4https://hdl.handle.net/20.500.12573/3694, Sezen/0000-0002-8990-1926; Bayram, Umit/0000-0001-8760-8024; Ata Esener, Pinar/0000-0002-6498-4534;The thermal conductivity variations with temperature for Zn90-x-Sn-x-Bi10 (x=5,10, 40 and 85wt%) and Bi88-x-Sn-x-Zn-12 (x=1.39, 43.26 and 79.3wt%) alloys were measured by using the linear heat flow method. From thermal conductivity-temperature plots, the coefficients of thermal conductivity for the Zn-Sn-Bi alloys were calculated. The microstructures of Zn-Sn-Bi alloys were observed using scanning electron microscopy (SEM). The existing phases into microstructure were identified energy dispersive X-ray (EDX) analysis. The melting temperatures, the enthalpy of fusion and specific heat change between the liquid and solid phases in the Zn-Sn-Bi alloys were determined from Differential Scanning Calorimetry (DSC) trace. The tensile strength and microhardness of the alloys were measured using a Shimadzu Universal Testing Instrument (Type AG-10 KNG) and Future-Tech FM-700 model microhardness device.eninfo:eu-repo/semantics/closedAccessArticle10.1007/s10854-018-00648-42-s2.0-85059858643